1N5820 - 1N5822 3.0 Ampere Schottky Barrier Rectifiers

electronic component 1N5820 - 1N5822 Symbol Parameter Value Units

IO Average Rectified Current

3/8 " lead length @ TA = 95°C

3.0 A

if(surge) Peak Forward Surge Current

8.3 ms single half-sine-wave

Superimposed on rated load (JEDEC method)

80 A

PD Total Device Dissipation

Derate above 25°C

3.6

36

W

mW/°C

RqJA Thermal Resistance, Junction to Ambient 28 °C/W

Tstg Storage Temperature Range -65 to +125 °C

TJ Operating Junction Temperature -65 to +125 °C

The Electrical Characteristics of LM339-partinchina.com

The information electronic component LM339 comes from Hqew.net

Input Offset Voltage (Note 9) 1.0 2.0 1.0 2.0 2.0 5.0 mVDC

Input Bias Current IIN(+) or IIN(−) with Output in 25 100 25 250 25 100 nADC

Linear Range, (Note 5), VCM=0V

Input Offset Current IIN(+)−IIN(−), VCM=0V 3.0 25 5.0 50 3.0 25 nADC

Input Common-Mode V+=30 VDC (LM3302, 0 V+−1.5 0 V+−1.5 0 V+−1.5 VDC

Voltage Range V+ = 28 VDC) (Note 6)

Supply Current RL = ∞ on all Comparators, 0.8 2.0 0.8 2.0 0.8 2.0 mADC

RL = ∞, V+ = 36V, 1.0 2.5 1.0 2.5 mADC

(LM3302, V+ = 28 VDC)

Voltage Gain RL≥15 kΩ, V+ = 15 VDC 50 200 50 200 50 200 V/mV

VO = 1 VDC to 11 VDC

Large Signal VIN = TTL Logic Swing, VREF = 300 300 300 ns

2SC5707 NPN Epitaxial Planar Silicon Transistors High Current Switching Applications

IC electronic component 2SC5707 NPN Epitaxial Planar Silicon Transistors High Current Switching Applications

Applications

• DC / DC converter, relay drivers, lamp drivers, motor drivers, flash.

Features

• Adoption of FBET and MBIT processes.

• Large current capacitance.

• Low collector-to-emitter saturation voltage.

• High-speed switching.

• High allowable power dissipation.

Market Volume and Forecast of china Smartphone Application IC Market

China Smartphone Application IC Market，

This research report presents market size and value forecast and recent quarter review of the china hqew.com Smartphone baseband, transceiver, power amplifier, application processor, GPS electronic component, such as p521,7805,tl431,ne555.Bluetooth IC, and Wi-Fi IC markets. The report includes baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC market volume, value, ASP, and market share by solution provider. The content of this report is based on primary data obtained through interviews with Smartphone component makers. The report finds that the Taiwanese Smartphone application IC market volume and value both grew approximately 33% sequentially in the second quarter of 2009, as the economy started showing signs of recovery and as the launch of the Apple iPhone 3GS stimulated the Taiwanese market. In the second half puma shoes online of 2009, the development of Smartphones towards mid and low price ranges will create demand among Smartphone manufacturers for low-cost chip solutions.

A handy guide to identify electronic components from their symbols

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Simple concept on the introduction of electronic components

Ic components is the components and devices in general. electronic components: refers to the production and processing in the factory does not change the molecular composition of electronic components

The finished product. Such as resistors, capacitors, inductors. Because it itself does not produce electronics, its voltage, current, and transform the role of uncontrolled, so called passive components. Electronic device: refers to the production and processing in the factory when the product changes the molecular structure

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The electronic components industry you know how much?

You are in an electronic industry? Electronics industry, you know it? Do you know the electronic components market?
Many electronic component, such as LM358/ LMV358IDR/ LMV358PW，you know their performance and manufacturers it?
A brief introduction for you：
The LM358/ BCV61C/ DFH05 is available in the space saving 5-Pin SC70, which is approximately half the size of the 5-Pin SOT23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.
Those information from Hqew.com